Manufacturing method of insulating circuit substrate with heat sink and insulating circuit board with heat sink

摘要

Problem to be solved: to provide an insulating circuit board having a heat sink capable of improving flatness of a circuit layer as an mounting surface of electronic components, etc., and an insulating circuit board with heat sink.In the manufacturing method of an insulating circuit substrate with a heat sink according to the present invention, a bonding step for joining a heat sink to a surface opposite to a circuit layer of an insulating circuit substrate on which one circuit layer is bonded to one surface of a ceramic substrate, and at least a central portion of the convex surface of the circuit layer after the bonding step is polished A polishing step for forming a flat mounting surface is provided.Diagram