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PROCÉDÉ DE RÉDUCTION DU DIAMÈTRE DE PORE À L'AIDE D'UN DÉPÔT ET D'UNE GRAVURE DE COUCHE ATOMIQUE

摘要

Methods are provided for manufacturing well-controlled, solid-state nanopores and arrays of well-controlled, solid-state nanopores by a cyclic process including atomic layer deposition (ALD), or chemical vapor deposition (CVD), and etching. One or more features are formed in a thin film deposited on a topside of a substrate. A dielectric material is deposited over the substrate having the one or more features in the thin film. An etching process is then used to etch a portion of the dielectric material deposited over the substrate having the one or more features in the thin film. The dielectric material deposition and etching processes are optionally repeated to reduce the size of the features until a well-controlled nanopore is formed through the thin film on the substrate.

著录项

  • 公开/公告号EP3685427A1

    专利类型

  • 公开/公告日2020.07.29

    原文格式PDF

  • 申请/专利权人

    申请/专利号EP18858513.7

  • 发明设计人

    申请日2018.09.11

  • 分类号

  • 国家 EP

  • 入库时间 2022-08-21 10:56:35

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