Resin composition, resin sheet, cured film, method for producing relief pattern of cured film, protective film, insulating film, electronic component and display device

摘要

PROBLEM TO BE SOLVED: To provide a resin composition capable of obtaining a cured film having a low warp and a low dielectric constant. SOLUTION: One or more kinds of alkali-soluble resin (A) selected from polyimide, polybenzoxazole, a polyimide precursor, a polybenzoxazole precursor and a copolymer composed of two or more kinds thereof, and the following general formula: A resin composition containing a resin (B) containing the structural unit represented by (1). [Selection diagram] None