PROCÉDÉ DE MONTAGE DE COMPOSANTS ÉLECTRONIQUES ET STRUCTURE DE MONTAGE DE COMPOSANTS ÉLECTRONIQUES

摘要

An electronic component mounting method comprises: a preparatory imaging step of storing preparation position information of component holding sections obtained based on preparation images imaged with no electronic component held by the component holding sections and with a rotary head indexed to multiple indexing angles; a pick-up step of picking up electronic components; an angle information acquisition step of acquiring indexing angle information of the rotary head when the final electronic component is picked up; an extraction step of extracting specific positional information from multiple pieces of preparation position information based on the indexing angle information and the multiple indexing angles of the rotary head at which the rotary head is imaged in the preparatory imaging step; a component imaging step of imaging the electronic components with the indexing angle of the rotary head made to coincide with an indexing angle of the rotary head that corresponds to the specific positional information; and a measurement step of measuring a positional deviation amount between a position of the multiple component holding sections that is recognized from the specific positional information and a position of the electronic component that is recognized from the component image obtained in the component imaging step.