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RÉPARTITEUR DE PUISSANCE INTÉGRÉ À SECTIONS MULTIPLES ET AMPLIFICATEURS À VOIES MULTIPLES COMPORTANT DES RÉPARTITEURS DE PUISSANCE INTÉGRÉS À SECTIONS MULTIPLES
RÉPARTITEUR DE PUISSANCE INTÉGRÉ À SECTIONS MULTIPLES ET AMPLIFICATEURS À VOIES MULTIPLES COMPORTANT DES RÉPARTITEURS DE PUISSANCE INTÉGRÉS À SECTIONS MULTIPLES
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摘要
A multiple-path amplifier includes a semiconductor die, an RF signal input terminal, and a power splitter. The power splitter includes a splitter input terminal coupled to the RF signal input terminal, and first and second splitter branches. The first splitter branch has first and second capacitor-inductor-capacitor (CLC) circuit sections coupled in series between the splitter input terminal and a first splitter output terminal. The second splitter branch has third and fourth CLC circuit sections coupled in series between the splitter input terminal and a second splitter output terminal. The multi-path amplifier also includes first and second amplifiers integrally formed with the semiconductor die. An input of the first amplifier is electrically coupled to the first splitter output terminal, and an input of the second amplifier is electrically coupled to the second splitter output terminal.
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