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BOÎTIER SEMI-CONDUCTEUR, MATRICE MOULÉE DE BOÎTIERS SEMI-CONDUCTEURS ET PROCEDE DE FABRICATION D'UN BOÎTIER SEMI-CONDUCTEUR
BOÎTIER SEMI-CONDUCTEUR, MATRICE MOULÉE DE BOÎTIERS SEMI-CONDUCTEURS ET PROCEDE DE FABRICATION D'UN BOÎTIER SEMI-CONDUCTEUR
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摘要
A reconstituted semiconductor package and a method of making a reconstituted semiconductor package are described. An array of die-attach substrates is formed onto a carrier. A semiconductor device is mounted onto a first surface of each of the die-attach substrates. An interposer substrate is mounted over each of the semiconductor devices. The interposer substrates are electrically connected to the first surface of the respective die-attach substrates. A molding compound is filled in open spaces within and between the interposer substrates mounted to their respective die-attach substrates to form an array of reconstituted semiconductor packages. Electrical connections are mounted to a second surface of the die-attach substrates. The array of reconstituted semiconductor packages is singulated through the molding compound between each of the die-attach substrates and respective mounted interposer substrates.
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