首页>
外国专利>
DISPOSITIFS D'ÉLÉMENTS BOSSELÉS À RF EN 2D ET EN 3D POUR UN SYSTÈME À RF DANS DES SUBSTRATS DE VERRE PHOTO-ACTIFS EN GROUPE
DISPOSITIFS D'ÉLÉMENTS BOSSELÉS À RF EN 2D ET EN 3D POUR UN SYSTÈME À RF DANS DES SUBSTRATS DE VERRE PHOTO-ACTIFS EN GROUPE
展开▼
展开▼
页面导航
摘要
著录项
相似文献
摘要
The present invention includes a method for creating a system in a package with integrated lumped element devices is system-in-package (SiP) or in photo-definable glass, comprising: masking a design layout comprising one or more electrical components on or in a photosensitive glass substrate; activating the photosensitive glass substrate, heating and cooling to make the crystalline material to form a glass-crystalline substrate; etching the glass-crystalline substrate; and depositing, growing, or selectively etching a seed layer on a surface of the glass-crystalline substrate on the surface of the photodefinable glass, wherein the integrated lumped element devices reduces the parasitic noise and losses by at least 25% from a package lumped element device mount to a system-in-package (SiP) in or on photo-definable glass when compared to an equivalent surface mounted device.
展开▼