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UNITÉ DE POLISSAGE DE BORD DE TRANCHE, ET APPAREIL ET PROCÉDÉ DE POLISSAGE DE BORD DE TRANCHE LA COMPRENANT
UNITÉ DE POLISSAGE DE BORD DE TRANCHE, ET APPAREIL ET PROCÉDÉ DE POLISSAGE DE BORD DE TRANCHE LA COMPRENANT
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摘要
An embodiment provides a wafer edge polishing unit comprising: a process chamber; a polishing stage which is arranged in a lower region of the process chamber and on which a wafer is arranged; a polishing unit, arranged at an edge of the polishing stage, for polishing the wafer; a slurry storage unit arranged in an upper region of the process chamber; a slurry supply unit for supplying a slurry to the slurry storage unit; a pure water supply unit for supplying pure water to an upper region of the polishing stage; a first pipe for supplying the slurry from the slurry storage unit to the polishing stage; a turbidity detection unit for detecting the turbidity of the slurry inside the first pipe; a second pipe for recovering the slurry from the polishing stage to the slurry storage unit; and a control unit for adjusting the amount of the slurry supplied from the slurry supply unit to the slurry storage unit according to the detected turbidity.
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