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STRUCTURES DE CIRCUITS INTÉGRÉS À GRILLE ENVELOPPANTE AYANT UNE FORTE MOBILITÉ

摘要

Gate-all-around integrated circuit structures having high mobility, and methods of fabricating gate-all-around integrated circuit structures having high mobility, are described. For example, an integrated circuit structure includes a silicon nanowire (504) or nanoribbon. A gate stack (508, 506) is around the silicon nanowire or nanoribbon, the gate stack including a compressively stressing gate electrode (506). A first N-type epitaxial source or drain structure (514) is at a first end of the silicon nanowire or nanoribbon. A second N-type epitaxial source or drain structure (516) is at a second end of the silicon nanowire or nanoribbon. The silicon nanowire or nanoribbon has a <110> plane between the first N-type epitaxial source or drain structure and the second N-type epitaxial source or drain structure.

著录项

  • 公开/公告号EP3653569A1

    专利类型

  • 公开/公告日2020.05.20

    原文格式PDF

  • 申请/专利权人

    申请/专利号EP19183100.7

  • 发明设计人

    申请日2019.06.28

  • 分类号

  • 国家 EP

  • 入库时间 2022-08-21 10:53:13

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