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Oxidative Leaching of metals from electronic waste with solutions based on quaternary ammonium salts

机译:基于季铵盐的溶液对电子废物中金属的氧化浸出

摘要

The treatment of electric and electronic waste (WEEE) is a problem which receives evermore attention. An inadequate treatment results in harmful products ending up in theenvironment.This project intends to investigate the possibilities of an alternative route for recycling ofmetals from printed circuit boards (PCBs) obtained from rejected computers. The processis based on aqueous solutions composed of an etchant, either 0.2 M CuCl2.2H2O or 0.2 MFeCl3.6H2O, and a quaternary ammonium salt (quat) such as choline chloride orchlormequat. These solutions are reminiscent of deep eutectic solvents (DES) based onquats. DES are quite similar to ionic liquids (ILs) and are used as well as alternativesolvents with a great diversity of physical properties, making them attractive forreplacement of hazardous, volatile solvents (e.g. VOCs).A remarkable difference between genuine DES and ILs with the solutions used in thisproject is the addition of rather large quantities of water. It is shown the presence of waterhas a lot of advantages on the leaching of metals, while the properties typical for DES stillremain.The oxidizing capacities of Cu(II) stem from the existence of a stable Cu(I) component inquat based DES and thus the leaching stems from the activity of the Cu(II)/Cu(I) redoxcouple. The advantage of Fe(III) in combination with DES is the fact that the Fe(III)/Fe(II)redox couple becomes reversible, which is not true in pure water. This opens perspectivesfor regeneration of the etching solution.In this project the leaching of copper was studied as a function of gradual increasing watercontent from 0 - 100w% with the same concentration of copper chloride or iron(III) chlorideat room temperature and 80ºC. The solutions were also tested on real PCBs. At roomtemperature a maximum leaching effect for copper was obtained with 30w% cholinechloride with 0.2 M CuCl2.2H2O. The leaching effect is still stronger at 80°C, b ut of coursethese solutions are more energy consuming. For aluminium, tin, zinc and lead, theleaching was faster at 80ºC. Iron and nickel dissolved easily at room temperature. Thesolutions were not able to dissolve gold, silver, rhodium and platinum.
机译:电气和电子废物(WEEE)的处理是一个日益受到关注的问题。处理不当会导致有害产品最终进入环境。该项目旨在研究从废弃计算机获得的印刷电路板(PCB)中回收金属的替代途径的可能性。该工艺基于水溶液,该水溶液由0.2 M CuCl2.2H2O或0.2 MFeCl3.6H2O蚀刻剂和季铵盐(季铵盐)(如氯化胆碱或氯仿)组成。这些解决方案让人想起基于季铵盐的深共熔溶剂(DES)。 DES与离子液体(ILs)非常相似,并且用作具有多种物理性质的替代溶剂,使其成为替代危险的挥发性溶剂(例如VOC)的诱人剂。真正的DES和ILs与溶液的区别非常明显该项目中使用的是添加大量的水。结果表明,水的存在对金属的浸提具有很多优势,而DES的典型特性仍然保留。Cu(II)的氧化能力源于稳定的基于Cu(I)组分水合物的DES的存在,因此浸出源于Cu(II)/ Cu(I)氧化还原对的活性。 Fe(III)与DES结合的优点是Fe(III)/ Fe(II)氧化还原对变得可逆,这在纯净水中并非如此。这为蚀刻液的再生开辟了前景。在该项目中,研究了在室温和80ºC相同浓度的氯化铜或氯化铁(III)的作用下,铜的浸出量从0-100w%逐渐增加的函数。该解决方案还在真实的PCB上进行了测试。在室温下,用30w%氯化胆碱和0.2 M CuCl2.2H2O可获得最大的铜浸出效果。在80°C时,浸出效果仍然更强,但是这些解决方案当然要消耗更多的能量。对于铝,锡,锌和铅,在80ºC下浸出速度更快。铁和镍在室温下容易溶解。该溶液不能溶解金,银,铑和铂。

著录项

  • 作者

    Pinheiro Diana;

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  • 年度 2009
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  • 原文格式 PDF
  • 正文语种 eng
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