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A study of the laser milling process for polycrystalline diamonds

机译:多晶金刚石激光铣削工艺的研究

摘要

A comprehensive literature review into the current status of the technologies for processing difficult-to-machine materials has been conducted. It has revealed that very limited research has been carried out to investigate the pulsed laser milling process for difficult-to-machine materials like polycrystalline diamonds (PCD), and to understand the physics behind this process.An experimental investigation has been undertaken to study the feasibility of nanosecond-pulsed laser milling process for PCDs and to understand the process characteristics. Plausible trends for the various milling performance measures, such as material removal rate, surface roughness and subsurface thermal damage, with respect to the process parameters have been revealed.A computational model for single-pulse laser ablation process has been developed and solved using the finite element method to understand the heating/cooling and material removal process in laser ablation of PCD. A comparison between the model predicted and the measured ablation depths has been carried out and shown that the model predictions agree well with the corresponding experimental data. The simulation results have shown that surface evaporation dominates the material removal process when laser pulse fluence exceeds the ablation threshold for PCD. Diamond graphitization results in heat accumulation, which leads to higher evaporation rates; melting and ejection of cobalt takes place at smaller pulse energies, which increases the heat loss.The single-pulse laser ablation model has then been extended to the study of laser milling process incorporating multiple traverse scans. The model predicted depths and profiles of the milled pockets show a good agreement with the corresponding experimental data. A simulation study has been carried out to investigate the temperature evolution and the material removal process involving different milling conditions, which has provided an in-depth understanding of the effects of process parameters on the laser milling process.This study has demonstrated the capability of laser milling process for PCDs. The analysis of the material removal mechanisms in both single pulse ablation and laser milling process has provided an in-depth understanding of the physical phenomena involved. The work has formed a solid basis for further research in this avenue to bring laser milling of PCDs into practical applications.
机译:已经对难加工材料的加工技术的现状进行了全面的文献综述。研究表明,对于难以加工的材料(如多晶金刚石(PCD))的脉冲激光铣削工艺,以及对这种工艺背后的物理原理的了解,目前仅进行了非常有限的研究。纳秒脉冲激光铣削PCD的可行性以及了解工艺特征。揭示了各种铣削性能指标的合理趋势,例如材料去除率,表面粗糙度和亚表面热损伤等与工艺参数有关的趋势。开发了单脉冲激光烧蚀工艺的计算模型并使用有限元求解元素方法,了解PCD激光烧蚀中的加热/冷却和材料去除过程。进行了模型预测值与实测烧蚀深度之间的比较,结果表明模型预测值与相应的实验数据吻合良好。仿真结果表明,当激光脉冲通量超过PCD的烧蚀阈值时,表面蒸发将主导材料的去除过程。金刚石石墨化导致热量积聚,从而导致更高的蒸发速率。钴的熔化和喷出发生在较小的脉冲能量下,这增加了热量的损失。单脉冲激光烧蚀模型随后被扩展到结合多次移动扫描的激光铣削过程的研究。该模型预测的铣削型腔的深度和轮廓与相应的实验数据显示出很好的一致性。进行了模拟研究,研究了温度变化和材料在不同研磨条件下的去除过程,从而深入了解了工艺参数对激光研磨过程的影响。该研究证明了激光的能力PCD的铣削过程。对单脉冲烧蚀和激光铣削过程中材料去除机理的分析提供了对所涉及物理现象的深入理解。这项工作为进一步研究将PCD的激光铣削投入实际应用奠定了坚实的基础。

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