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Charge storage and decay in high temperature insulating materials.

机译:高温绝缘材料中的电荷存储和衰减。

摘要

This dissertation deals with the studies of charge storage and decay in aromatic and composite polyamide materials for the first time, along with an extended study of the conduction currents in Teflon (PTFE) at higher ranges of applied electric fields and 2 temperatures, where the data obtained fills the gap in the published literature. Different experimental techniques are employed to identify the mechanisms responsible for conduction currents, charge storage, and decay in aromatic and composite polyamides. The insulating materials tested during the course of this dissertation are chosen because of their engineering importance and lack of published literature on them. Several studies reported in this dissertation on these materials are believed to have been carried out for the first time. The results of the conduction current in Teflon (PTFE) indicated that the ionic space charge mechanism is operative at temperatures $leq$120$spcirc$C, while electronic space charge at temperatures $u3e$120$spcirc$C. The low frequency dielectric loss factor in aramid paper shows two relaxation peaks due to dipolar reorientation at T $leq$ 190$spcirc$C, and no relaxation peak at T = 200$spcirc$C suggesting an interfacial polarization mechanism. A relaxation time of 6.3 $imes$ 10$sp{m 4}$ s at room temperature with an activation energy of 0.84 eV was obtained from the thermally stimulated polarization (TSP) current in aramid paper with total polarization of 1.73 $mu$Cm$sp{-2}$ at a heating rate of 2 Kmin$sp{-1}$. The X-ray diffraction results show an improvement in the polymer crystallization when exposed to higher annealing temperature of 300$spcirc$C. The results of the low frequency dielectric loss factor in composite polyamide shows one broad relaxation peak at T $leq$ 103$spcirc$C which is due to the dipolar polarization, while for T $ge$ 140 no relaxation frequency was observed and the low frequency loss factor increases rapidly with decreasing frequency suggesting an interfacial polarization mechanism. The Pool-Frenkel and ionic hopping mechanisms were responsible for the conduction current in composite polyamide. The thermally stimulated depolarization (TSD) current results show that the fast dipoles are oriented at lower poling temperature while slow dipoles are at higher poling temperatures. The windowing polarization result shows that the distribution of the relaxation time of the dipolar process for T $le$ 130$spcirc$C is thermally activated with activation energies in the range of 1.01 to 1.55 eV in the temperature range of 70 to 130$spcirc$C. (Abstract shortened by UMI.)Dept. of Electrical and Computer Engineering. Paper copy at Leddy Library: Theses u26 Major Papers - Basement, West Bldg. / Call Number: Thesis1993 .S888. Source: Dissertation Abstracts International, Volume: 54-09, Section: B, page: 4854. Adviser: G. R. Govinda Raju. Thesis (Ph.D.)--University of Windsor (Canada), 1993.
机译:本文首次研究了芳香族和复合聚酰胺材料中电荷的存储和衰减,并进一步研究了特氟隆(PTFE)在较高电场和2个温度范围内的传导电流,其中数据获得的结果填补了已发表文献的空白。采用不同的实验技术来确定引起芳族和复合聚酰胺传导电流,电荷存储和衰减的机理。选择绝缘材料是因为它们的工程重要性以及缺乏有关它们的公开文献。据认为,本文是首次对这些材料进行了几项研究。铁氟龙(PTFE)中的传导电流结果表明,离子空间电荷机理在温度$ leq $ 120 $ sp circ $ C时有效,而电子空间电荷在温度$ u3e $ 120 $ sp circ $时有效C。芳纶纸中的低频介电损耗因子由于在T $ leq $ 190 $ sp circ $ C处的偶极取向而显示两个弛豫峰,在T = 200 $ sp circ $ C处没有弛豫峰,表明存在界面极化机制。从芳族聚酰胺纸中的总极化强度为1.73 $的热激发极化(TSP)电流获得室温下的弛豫时间为6.3 $乘以10 $ sp { rm 4} $ s,活化能为0.84 eV。 mu $ Cm $ sp {-2} $,加热速率为2 Kmin $ sp {-1} $。 X射线衍射结果表明,当暴露于300℃/℃的较高退火温度下时,聚合物结晶得到改善。复合聚酰胺中的低频介电损耗因子的结果显示,在T $ leq $ 103 $ sp circ $ C处有一个宽的弛豫峰,这是由于偶极极化引起的,而对于T $ ge $ 140则没有弛豫频率观察到低频损耗因子随频率降低而迅速增加,表明存在界面极化机制。 Pool-Frenkel和离子跳跃机制负责复合聚酰胺中的导电电流。热激发去极化(TSD)电流结果表明,快速偶极子在较低的极化温度下取向,而慢速偶极子在较高的极化温度下取向。窗口化极化结果表明,在70°C的温度范围内,T $ le $ 130 $ sp circ $ C的偶极过程的弛豫时间分布被激活,其活化能范围为1.01至1.55 eV。到130 $ sp circ $ C。 (摘要由UMI缩短。)电气和计算机工程系。莱迪图书馆的纸质副本:论文主要论文-西楼地下室。 /电话号码:Thesis1993 .S888。资料来源:国际论文摘要,第54-09卷,第B部分,第4854页。顾问:G。R. Govinda Raju。论文(博士学位)-温莎大学(加拿大),1993。

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