Solar grade silicon production is an energy intensive and harmful to the environment process. Yet 40% of this valuable product material is lost into sawdust (kerf loss) during wafering. The kerf waste from Fixed Abrasive Sawing of PV silicon wafers is pelletized and then remelted in an induction furnace. The furnace has a square cross-section quartz crucible, surrounded by graphite susceptors and heated by an induction coil that enables directional solidification of the new ingot. Top and bottom 'pancake' coils provide additional temperature control. Once melted, silicon becomes electrically conductive and subject to stirring by induction. To recycle the silicon, particulate impurities (due to the sawing, condensed silicon oxides or carbides) need to be removed. Flow control and the electromagnetic Leenov-Kolin force are used to expel particulates, through a novel dual frequency induction scheme. Three-dimensional, multi-physics numerical modelling captures the electromagnetic, fluid-flow and heat-transfer effects in this process. The presented results show it is possible to retain the impurity particles on the sides of the solidified ingot where they can be sliced off and removed.
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