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Electrical Resistivity Imaging for Detecting Soil Cracking at the Centimetric Scale

机译:用于检测厘米级土壤开裂的电阻率成像。

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摘要

Electrical resistivity measurements at high resolution (1.5-cm electrode spacing) were performed to detect, from the soil surface, small cracks developing within the soil. We recorded a vertical electrical pseudo-section in a decimetric undisturbed homogenous soil block (silt loam) for different artificial cracking stages. Because of the unusually reduced electrode spacing associated with an air-dried soil surface, a specific Cu/CuSO4 electrode was designed for precision wet contact at given points. The apparent resistivity measurements of the pseudo-section and the interpreted data inverted by using the Res2Dinv software are discussed. The range of interpreted electrical resistivity associated with cracking is considerable, (from 168 to 2185 m) because the cracks are filled with air that is an infinitely resistant medium. Results showed that even small structures cause perceptible changes in resistivity that can be detected by the electrical resistivity method. Results also showed that specific software is required to predict real crack depth.
机译:进行高分辨率(1.5cm电极间距)的电阻率测量以检测土壤表面,从土壤中发育的小裂缝进行检测。我们记录了一个垂直的电气伪截面,以用于不同的人工裂解阶段的比例未受干扰的均匀土块(淤泥壤土)。由于与空气干燥的土壤表面相关的相同的电极间距,设计了特定的Cu / CuSO4电极,用于在给定点处进行精密湿接触。讨论了使用RES2DINV软件反转的伪截面和解释数据的表观电阻率测量。与裂缝相关的解释电阻率的范围是相当大的,因为裂缝填充有无限抗性介质的空气。结果表明,即使是小结构也会导致电阻率法检测的电阻率变化。结果还表明,需要特定的软件来预测真正的裂缝深度。

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