Epoxy-Bonded Molecular-Sieve Desiccants

摘要

Techniques for fabricating structural components from desiccants by compression molding dry epoxy-desiccant mixtures and by cold pressing wet epoxy-desiccant formulations are described. The epoxy content ranges from 10 to 30 percent by weight. The molded desiccants adsorb 10 to 20 percent moisture by weight, depending on test conditions and type and amount of molecular sieve. The molded desiccants exhibit compressive strengths ranging from 1000 to 10,000 psi, depending on processing conditions and amount and type of binder. Extensive data on mechanical, electrical, thermal, and adsorption characteristics of molded desiccant are presented. (Author)