Electronics: Development of a Fully Automatic Process for the Wireless Bonding of Integrated Circuits

摘要

The report deals with the development and application of the Sicon technique for the completely automatic, wireless mounting of integrated-circuit wafers. Information is presented on the deposition of the gold balls and route followed in attaining the requisite solderability of the spider legs to these, particular emphasis being placed on the various metal plating and coating systems tried. The scanning and positioning techniques employed for the individual integrated-circuit wafers passing through the automatic, wireless-mounting equipment are described. Basically, the scanning is effected with a television camera and final positioning carried out with a computer - linked 'X' - and 'Y' - co-ordinate drive system. The Sicon, wireless-mounting technique is extremely economic and suitable both for high-reliability integrated-circuit wafers and for devices incorporated in consumer products.