Micro-focus X-ray imaging

摘要

The acceptance of surface mounting in the electronics industry has been slowed by problems with component availability, electrical testing, and inspection. Industry suppliers and users have been working to solve these problems, and they are easing. Component manufacturers are offering substantially more devices in surface mountable packages. Automated test equipment vendors are offering test fixtures for surface mount circuit boards. And just recently, solder connection inspection has been automated through a partership effort with a major electronics manufacturer. The results achieved in this effort are presented.