Laser Ablation Using Nano-Second and Pico-Second Lasers.

摘要

This work was to determine the feasibility of using lasers to cut parts to a controlled depth. Three technologies were investigated. The first technology was to use a high powered CW laser with assist gas to cut to a desired depth. The other two technologies investigated were pulsed laser of nano and pico second pulse durations. Cuts were conducted in ablation mode on various materials and the resulting cuts were evaluated for cut quality, depth control and the microstructural changes. The results indicated that CW lasers would not work for the desired application, but nano-second and pico-second lasers showed excellent results and demonstrated that it might be feasible to perform deep ablation using these technologies.