Laser tabbed die: A repairable, high-speed die-interconnection technology. 1994 LDRD final report 93-SR-089

摘要

A unique technology for multichip module production is presented. The technology, called Laser Tabbed Die (L-TAB), consists of a method for forming surface-mount-type (open quotes)gull wing(close quotes) interconnects on bare dice. The dice are temporarily bonded to a sacrificial substrate which has a polymer thin film coated onto it. The gull wings are formed on the side of the die with a direct-write laser patterning process which allows vertical as well as horizontal image formation. Using the laser patterning system, trenches are formed in a positive electrodeposited photoresist (EDPR) which is plated onto a metal seed layer, allowing copper to be electroplated through the resultant mask. After stripping the resist and the metal seed layer, the polymer film on the substrate is dissolved, releasing the chip with the (open quotes)gull wings(close quotes) intact. The chips are then bonded onto a circuit board or permanent substrate with solder or conductive adhesive.