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Effects of Temperature and Humidity on Wilethane 44 Cure

机译:温湿度对Wilethane 44固化的影响

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Wilethane 44 is a polyurethane adhesive developed by the Materials Team within ESA-MEE at Los Alamos National Laboratory as a replacement for Hexcel Corporation Urethane 7200. Urethane 7200 is used in numerous weapon systems, but it was withdrawn from the market in 1989. The weapons complex requires a replacement material for use in the W76-1 LEP and the W88, as well as for assembly of JTAs for other warheads. All polyurethane systems are susceptible to moisture reacting with unreacted isocyanate groups. This side reaction competes with the curing reaction and results in CO(sub 2) formation. Therefore, a polyurethane adhesive can exhibit foaming if appropriate environmental controls are not in place while it cures. A designed experiment has been conducted at TA-16-304 to determine the effects of ambient conditions on the properties of cured Wilethane 44. Temperature was varied from 15 C to 30 C and relative humidity from 15% to 40%. The density, hardness at 24 hours, and butt tensile strength on aluminum substrates were measured and fitted to quadratic equations over the experimental space. Additionally, the loss and storage moduli during cure were monitored as a function of cure temperature. These experiments provide a stronger basis for establishing appropriate environmental conditions and cure times when using Wilethane 44. The current guidelines are a working time of 90 minutes, a cure time of 18 hours, and a relative humidity of less than 25%, regardless of ambient temperature. Viscosity measurements revealed that the working time is a strong function of temperature and can be as long as 130 minutes at 15 C or as short as 90 minutes at 30 C. The experiments also showed that the gel time is much longer than originally thought, as long as 13 hours at 15 C. Consequently, it may be necessary to extend the required cure time at temperatures below 20 C. Allowable humidity varies as a function of temperature from 34% at 15 C to 15% at 30 C.

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