Thermal and Mechanical Limit Study for Sandia Laboratories Generation I and II Hybrid Microcircuit Technology

摘要

Samples of chip capacitors epoxied to chrome-gold metallized substrates using thermocompression bonded 2.54 x 10 exp -2 mm gold flying wire interconnections; thermocompression bonded integrated circuits; wire and ribbon thermocompression bonded crossovers; and soldered chip capacitors were subjected to the mechanical and thermal environments as specified in MIL-STD-883, method 5006, ''Limited Testing.'' In addition, some samples were aged at 150 exp 0 C for 1000 h prior to experiencing the environmental test series. The purpose for ''Limit Testing'' is to establish the maximum mechanical and thermal capabilities of the Sandia Laboratories hybrid microcircuit technology. This evaluation indicated that the present hybrid technology will survive extreme mechanical and thermal environmental conditions, except for long term aging of soldered components which have a significant detrimental effect on solder joint strength.