Mechanical Properties of Polystyrene Bead Encapsulation Foam

摘要

The tensile and compressive properties of polystyrene bead foam used as an encapsulant for electronic devices were determined for densities ranging from 0.3 to 0.6 g/cm exp 3 . Data were generated for these properties at -54, 25, and 74 exp 0 C. Data previously reported for 0.2 g/cm exp 3 are included. (ERA citation 05:027516)