Interface Formation in Physically Deposited Films.

摘要

Short (10 to 15 min) physical vapor deposition cycles are employed in fabricating thin films of 3 to 4 mu m. Interruption of a cycle is of concern, particularly for longer cycles, since loss of processing time becomes a major factor when rejecting all interrupted runs. Several substrate samples having aluminum deposits that had been interrupted during the deposition cycle were prepared to evaluate the formation of interfaces between the layers. In the case where the deposition was interrupted but the thermal and vacuum conditions were maintained, the presence of a layer or interface was not detected by Auger Electron Spectrometry (AES), scanning electron microscopy (SEM) and optical microscopy analytical techniques. (ERA citation 08:054236)