Plating and Plating Solution Analysis by Inductively Coupled Argon Plasma Spectrometer: Final Report

摘要

Plating solutions containing rhodium, gold, copper, tin, and zinc were analyzed for major constituents and trace impurities. Results of synthetic and real baths analyzed by an inductively coupled argon plasma spectrometer (ICAP) were compared to results obtained by using classical chemical methods to determine accuracy. Tin-lead plated deposits and solder were analyzed for tin, lead, and 11 other elements considered impurities. Rhodium and gold solutions were assayed for inventory purposes. Gold plating was analyzed by determining 26 elements to meet a pure gold specification requirement of 99.9%. Results indicated that the ICAP methods that were developed had sufficient accuracy to be used for control of plating operations and precious metal inventory. 4 refs., 4 tabs. (ERA citation 12:025334)