Application of Image Analysis for Infrared Microspectroscopic Detection of Contaminants on Microelectronic Devices.

摘要

The use of infrared microscopy imaging for the location and identification of contaminants on microelectronic devices is discussed. Several methods are compared for the reconstruction of images from the infrared spectrum acquired at each pixel. Peak-height or peak-integration methods require prior information about the contaminant to narrow the spectral region of interest. These methods were found to be superior to full spectrum methods. When full-spectrum methods must be used, Gram-Schmidt reconstruction was found to perform slightly better than the integration method. 2 refs., 4 figs.