Determination of the Mechanical Properties of Diamond and Diamond-Like Films by the Ultra-Low Load Indentation Technique.

摘要

Diamond and diamond-like films were characterized with a mechanical properties microprobe (MPM) and compared to a natural IIa diamond and single crystal sapphire characterized by the same method. The diamond films were 125 to 375 mu m thick with a fine-grained microstructure (approximately 20- mu m-diam grains). The natural diamond was a IIa quality diamond with the (100) axis normal to the surface. The sapphire used had low dislocation density with the c-axis normal to the surface. The diamond-like carbon film (DLC) was rf glow discharge deposited to a thickness of about 0.2 mu m. Results of the present study are given and future work is discussed. 8 refs., 5 figs.