Pd and Ni Thin-Film Reactions with InP: Possibilities for Metal Contacts.

摘要

An effort has been made to identify metals whose interactions with InP result in phases with thermal stability, uniform morphology, and good reproducibility. Such metals can be useful as components for ohmic contacts to InP and would be superior to standard Au-Ge contacts, which are known to have very rough morphologies with deep protrusions into the underlying semiconductor. Palladium and nickel were chosen for this study because of good results previously reported for these metals with GaAs. 99 refs.