Experimental determination of the Cu-In-Pb ternary phase diagram

摘要

Use of lead-indium solders in microelectronics packaging has increased over the last decade. Increased usage is due to improved properties, such as greater thermo-mechanical fatigue resistance, lower intermetallic formation rates with base metallizations, such as copper, and lower reflow temperatures. However, search of literature reveals no comprehensive studies on phase equilibrium relations between copper metal and lead-indium solder. Our effort involves a combination of experimental data acquisition and computer modeling to obtain the Cu-In-Pb ternary phase diagram. Isotherms and isopleths of interest at low temperatures are achieved by means of differential scanning calorimetry and electron probe microanalysis. Thermodynamic models of these sections served as a guide for efficient experimentation.