Development of High Thermal Conductivity Electrical Embedding Compounds

摘要

This report describes the development of high thermal conductivity electrical embedding compounds utilizing a technique wherein the mold is first filled with large particle, high thermal conductivity tabular alumina, then impregnated by mixtures of epoxy compounds and small particle tabular alumina. Contained herein, are the pertinent results of a previously reported study which led to the development of three high thermal conductivity compounds, and the further development of several additional compounds with still higher conductivities. (Author)