Thermal Analysis Considerations of Hybrid Microelectronic Circuits.

摘要

This report presents the results of an analytical study of heat flow in hybrid microelectronic circuits and packages. The study is divided in two parts. First, heat removal from the package by convection and radiation is considered. Second, conduction of heat from an active chip area to a heat-sinked package header is modeled by use of finite-difference methods. Typical examples are worked to illustrate the analytical approach, and computer results of the finite-difference method are presented. (Author)