Optoelectronic Devices Packaged for Fiber Optics Application. Volume I.

摘要

This document has been prepared to describe the development of a packaging concept for LEDs and photodiode detectors that is optimized for use in fiber optic data transmission systems. The package outline is the same for both LEDs and photodiodes. A total of 250 LEDs and 250 photodiodes were fabricated, tested and delivered to NAFI. The LEDs achieved power outputs to 3.OmW at 100mA bias. This report constitutes the first of a two volume set describing the work related to development of optoelectronic devices and packaging for fiber optics applications. The second volume describes modifications to the package to achieve a hermetic seal and the development of a reliable technique for accurately positioning and soldering the component package into the optoelectronic termination assembly. 200 LEDs and 200 photodiodes were inserted and soldered into the terminating assemblies.