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A Computerized Acoustical Array System to Test Bonded Radome Joints.

机译:一种用于测试保税天线罩接头的计算机声学阵列系统。

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Ceramic randomes are tested using an ultrasonic transducer array in the vicinity of the randome attachment ring bond line where the structural problems are particularly great. The array consists of 14 one-fourth inch transducers in line, with water couplant and operating in a 2.25 MWZ pulse/echo mode. Mechanical rotation of the radome generates the scan axis along the radome circumference. Flaws are determined by the character of the ultrasonic echo from the bond line. The resolution limit is one-fourth inch with one-fourth inch transducers. If better resolution is desired one eight inch steps can be taken in both the horizontal and vertical directions to obtain approximately one eighth inch resolution. Displays are presented on storage monitors and computer plots. Each scan of the radome joint takes approximately one minute. The results of these studies show clearly that the array is capable of differentiating three major types of flaws: silica inclusions and cracks, adhesive silica flaws, and adhesive fiberglass flaws. (Author)

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