Some Mechanisms of Action of Additives in Electrodeposition Processes

摘要

A review is given of mechanisms by which additives have been postulated to affect the rate of deposition of metals. These mechanisms include (1) blocking the surface, (2) changes in Helmholtz potential, (3) complex formation including induced adsorption and ion bridging, (4) ion pairing, (5) changes in interfacial tension and filming of the electrode, (6) hydrogen evolution effects, (7) hydrogen absorption, (8) anomalous codeposition and (9) the effect on intermediates.