Electrochemical and Scanning Tunneling Microscopic Study of Dealloying of Cu3Au.

摘要

Dealloying of copper gold alloys has been examined by in-situ STM and several electrochemical methods. Three different regimes of behavior were noted. At low overpotentials, clustering of gold atoms occurs near sites of copper dissolution. This is essentially a two-dimensional process. The formation and smoothing of these clusters by capillary action, monitored in real time, demonstrated the highly mobile nature of the surface species. At higher potentials, the electrode is largely passivated by the enrichment of gold. However, there exist small localized regions of three-dimensional roughness which may be correlated to extended dealloying catalyzed by bulk solid-state defects.