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Molecular dynamics simulations on the oxidation of Si(100)/SiO2 interface: Emissions and incorporations of Si-related species into the SiO2 and substrate

机译:Si(100)/ SiO2界面氧化的分子动力学模拟:Si相关物质在SiO2和衬底中的排放和掺入

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Si(100)-oxidation processes at the Si/SiO2 interface and in the SiO2 region are investigated focusing on the dynamics of Si and SiO emissions from the interface and the following incorporation into the substrate and/or SiO2. To clarify these atomic processes, classical molecular dynamics (MD) simulations with variable charge interatomic potentials are performed. By incorporating oxygen atoms, twofold coordinated (twofolded) Si atoms are formed after structural relaxation at the interface. The energy changes of the twofolded Si emissions into the substrate and SiO2 are estimated to be 2.97-7.81 eV. The energy barrier of the twofolded Si emission as SiO molecule is estimated to be 1.20 eV on the basis of the enthalpy change in an MD simulation. The emitted SiO molecule is incorporated into the SiO2 network through a Si-O rebonding process with leaving local deficiency of oxygen, i.e., generating an oxygen vacancy. The energy barrier of the SiO incorporation is estimated to be 0.79-0.81 eV. The elementary process of oxygen vacancy diffusion leading to the complete SiO incorporation are also simulated, and the energy barriers are found to be relatively small, 0.71-0.79 eV. The energy changes of Si emissions into the substrate and SiO2 are larger than the energy barrier of the SiO emission, which suggests that, at the ideally flat Si/SiO2 interface with relatively small oxidation stress, the SiO emission into the SiO2 region occurs prior to the Si emission. This result is consistent with previous theoretical and experimental studies. The above-mentioned typical atomic processes are successfully extracted from some (or one) of MD simulations among many trials in which a statistical procedure is partly employed. Our results give a unified understanding of Si oxidation processes from an atomistic point of view. (C) 2014 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim
机译:研究Si / SiO2界面和SiO2区域中的Si(100)-氧化过程,重点是从界面的Si和SiO排放的动力学以及随后掺入衬底和/或SiO2中的动力学。为了阐明这些原子过程,执行了具有可变电荷原子间电势的经典分子动力学(MD)模拟。通过结合氧原子,在界面处结构弛豫之后,形成了两个配位(两个)的Si原子。进入基板和SiO2的两倍Si发射的能量变化估计为2.97-7.81 eV。根据MD模拟中的焓变,将两倍的Si发射作为SiO分子的能垒估计为1.20 eV。所发射的SiO分子通过Si-O重新键合过程结合到SiO 2网络中,而局部缺氧,即产生氧空位。 SiO掺入的能垒估计为0.79-0.81 eV。还模拟了导致SiO完全结合的氧空位扩散的基本过程,发现能垒相对较小,为0.71-0.79 eV。进入基板和SiO2的Si发射的能量变化大于SiO发射的能垒,这表明在理想的平坦的Si / SiO2界面且氧化应力较小的情况下,进入SiO2区域的SiO发射先于硅发射。该结果与先前的理论和实验研究一致。在许多试验中,从部分(或一种)MD模拟中成功提取了上述典型原子过程,其中部分采用了统计程序。我们的结果从原子学角度对Si氧化过程提供了统一的理解。 (C)2014 WILEY-VCH Verlag GmbH&Co.KGaA,Weinheim

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