...
首页> 外文期刊>Physica status solidi, B. Basic research >Representative hybrid model used for analyses of heat capacities of group-IV, III–V, and II–VI materials
【24h】

Representative hybrid model used for analyses of heat capacities of group-IV, III–V, and II–VI materials

机译:具有代表性的混合模型,用于分析IV,III-V和II-VI组材料的热容量

获取原文
获取原文并翻译 | 示例
           

摘要

Characteristic non-Debye features inherent to the dispersionrelated hybrid model, which had been devised for the sake of physically adequate representations of isobaric heat capacities of semiconductor and wide band gap materials, are demonstrated and discussed in some detail. We perform least-meansquare fittings of low- and high-temperature C_p(T) data sets that are available for group-IV materials (diamond, Si, Ge, 3C-SiC), III–V materials (BN, BP, BAs, AlN, AlP, AlAs, AlSb, GaN, GaP, GaAs, GaSb, InP, InAs, InSb), and II–VI materials (ZnO, ZnS, ZnSe, ZnTe, CdO, CdS, CdSe, CdTe). The simulations of the C_p(T) data sets under study, particularly with respect to the cryogenic region, are graphically represented, and existing data deficiencies are discussed. Important by-products of the fittings are presented within the frame of Supporting Information (online at: www.pss-b.com). There are given in tabulated form the characteristic phonon energies, ε_P(m), for integral orders, m=-2, -1, 0, 1, 2, and 4, including further dispersion-related parameters like average phonon temperatures, QP, dispersion coefficients,DP, and high-temperature limiting values of Debye temperatures,QDh(1). Furthermore, basing on comprehensive calculations of the Cp(T) dependences from absolute zero up to room temperature, we provide representative values of entropies, Sp(T), enthalpies, H_p(T)-H_p(0), and Gibbs free energies, G_p(T)-G_p(0), for the frequently considered reference point, T_r=298.15 K, the accurate knowledge of which is indispensable for possible high-temperature continuations of these standard thermodynamic functions within the frame of the commonly used thermo-chemical formalism.
机译:为了详细介绍和讨论半导体和宽带隙材料的等压热容量而设计的,与分散相关的混合模型固有的非德拜特征,这些特征已被设计出来。我们对低温和高温C_p(T)数据集执行最小均方拟合,这些数据集可用于IV组材料(金刚石,Si,Ge,3C-SiC),III–V材料(BN,BP,BA, AlN,AlP,AlAs,AlSb,GaN,GaP,GaAs,GaSb,InP,InAs,InSb)和II–VI材料(ZnO,ZnS,ZnSe,ZnTe,CdO,CdS,CdSe,CdTe)。用图形表示了正在研究的C_p(T)数据集的仿真,尤其是针对低温区域的仿真,并讨论了现有数据的不足。配件的重要副产品显示在支持信息的框架中(在线网址:www.pss-b.com)。以表格形式给出了积分阶数m = -2,-1、0、1、2和4的特征声子能量ε_P(m),包括其他与色散相关的参数,例如平均声子温度,QP,色散系数DP和德拜温度的高温极限值QDh(1)。此外,基于对从绝对零到室温的Cp(T)依赖性的综合计算,我们提供了熵,Sp(T),焓,H_p(T)-H_p(0)和吉布斯自由能的代表值, G_p(T)-G_p(0),对于经常考虑的参考点T_r = 298.15 K,准确的知识对于常用热化学框架内这些标准热力学函数的可能高温延续是必不可少的形式主义。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号