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PID - 1,500V readiness of PV modules: Some solutions and how to assess them in the lab

机译:PID-光伏组件1,500V就绪:一些解决方案以及如何在实验室中进行评估

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Even though it is now more than five years since potential-induced degradation (PID) began to proliferate, and despite the fact that solutions are under development, it is currently still the most discussed mode of degradation associated with cracking in PV modules. This is probably because of the serious consequences that can rapidly be triggered when PV systems are affected. Although test specifications have been established (IEC 62804), there is no pass or fail criterion for identifying a PID-free module. This paper presents several ways of addressing the problem of PID at the module and cell levels, by considering glass, encapsulants, thin-film barriers and ion-implanted cells. The proposed solutions are tested in accordance with a specific test protocol, and an applied voltage of 1,500V is used in order to prepare for the future increase in DC plant voltage. An initial PID test was conducted on minimodules at room temperature (25℃ and Al foil), before proceeding to a more severe test at 70℃ (Al foil); this made it possible to clearly differentiate the influences of the different tested materials on PID degradation of the modules. These tests were carried out on 60-cell modules under the following conditions: test duration of 192h, temperature of 75℃, relative humidity of 85% and applied voltage of -1,500V. In contrast to ethylene-vinyl acetate (EVA) and standard glass modules, no evident degradation was observed with thermoplastic polyolefin (TPO), ionomer (ION), and thin chemically tempered glass modules; similarly, no degradation was evident with Al_2O_3-layer (deposited under the SiN layer at the cell level) modules or ion-implanted cell modules. The use of one of these components can therefore be a potential solution to the problem of PID.
机译:尽管自从潜在诱发的降解(PID)开始扩散至今已超过五年,并且尽管正在开发解决方案,但它仍是目前讨论最多的与PV模块破裂相关的降解方式。这可能是由于严重的后果,当光伏系统受到影响时,这些后果会迅速触发。尽管已经建立了测试规范(IEC 62804),但是没有用于识别无PID模块的通过或失败标准。本文介绍了通过考虑玻璃,密封剂,薄膜势垒和离子注入电池来解决模块和电池级PID问题的几种方法。建议的解决方案根据特定的测试协议进行了测试,并使用了1,500V的施加电压,以为将来DC设备电压的增加做准备。在室温(25℃和铝箔)下,对微型模块进行了初始PID测试,然后在70℃(铝箔)上进行了更严格的测试。这样就可以清楚地区分不同测试材料对模块PID降级的影响。这些测试是在以下条件下对60电池模块进行的:测试时间为192h,温度为75℃,相对湿度为85%,施加电压为-1,500V。与乙烯-乙酸乙烯酯(EVA)和标准玻璃组件相比,热塑性聚烯烃(TPO),离聚物(ION)和薄化学钢化玻璃组件没有观察到明显的降解。类似地,Al_2O_3层(沉积在细胞水平的SiN层下)模块或离子注入的细胞模块也没有明显的降解。因此,使用这些组件之一可以潜在地解决PID问题。

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