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Dynamic balance between grain refinement and grain growth during high-pressure torsion of Cu powders

机译:铜粉高压扭转过程中晶粒细化与晶粒长大之间的动态平衡

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摘要

High-pressure torsion (HPT) was applied to unmilled coarse-grained (CG) Cu powders with low initial dislocation density and cryomilled nanocrystalline (nc) Cu powders with high initial dislocation density, with identical processing parameters. HPT of unmilled CG Cu powders resulted in exceptional grain refinement and increase in dislocation density, whereas significant grain growth and decrease in dislocation density occurred during HPT of cryomilled nc Cu powders. Equilibrium structures were achieved under both conditions, with very similar stable grain sizes and dislocation densities, suggesting dynamic balances between deformation-induced grain refinement and grain growth, and between deformation-induced dislocation accumulation and dislocation annihilation. The equilibrium structures are governed by these two dynamic balances.
机译:将高压扭力(HPT)应用于初始位错密度低的未研磨粗晶粒(CG)铜粉和初始位错密度高的低温研磨的纳米晶(nc)铜粉,具有相同的加工参数。未研磨的CG Cu粉末的HPT导致晶粒异常细化并增加了位错密度,而在低温研磨的nc Cu粉末的HPT过程中出现了明显的晶粒长大和位错密度降低。在这两种条件下均达到了平衡结构,晶粒尺寸和位错密度非常相似,表明变形引起的晶粒细化与晶粒长大之间以及变形引起的位错累积与位错an灭之间存在动态平衡。平衡结构由这两个动态平衡支配。

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