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Structure and properties of loaded silica contacts during pressure solution: Impedance spectroscopy measurements under hydrothermal conditions

机译:压力溶液中负载的二氧化硅触点的结构和性质:在水热条件下的阻抗谱测量

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In order to investigate directly the structure and properties of grain oundaries in silicate materials undergoing pressure solution, in situ measurements of these properties are required. We report electrical impedance spectroscopy measurements, performed, under hydrothermal conditions, on individual glass-glass and glass-quartz contacts undergoing pressure solution. Resulting estimates of the average grain boundary diffusivity product (Z = DδavC* for silica transport and of the average grain boundary fluid film thickness fall in the ranges 6.3 ± 1. 4 × 10-18 m3s-1 and 350 ± 210 nm, respectively. However, the average values for Z and (δav) obtained were likely influenced by cracking and irregular dissolution of the dissolving contact surfaces, rather than representing uniformly wetted grain boundary properties. Post-mortem SEM observations indicate that the contact surfaces were internally rough. Taken together, our data support the notion that during pressure solution of quartz, grain boundary diffusion is rapid, and interface processes (dissolution and precipitation) are more likely to be rate-limiting than diffusion.
机译:为了直接研究经受压力固溶的硅酸盐材料中晶界的结构和性质,需要对这些性质进行原位测量。我们报告了在水热条件下对承受压力溶液的单个玻璃-玻璃和玻璃-石英触点进行的电阻抗光谱测量。二氧化硅迁移的平均晶界扩散率乘积(Z =DδavC*)和平均晶界流体膜厚度的最终估计值分别在6.3±1。4×10-18 m3s-1和350±210 nm范围内。但是,所获得的Z和(δav)的平均值很可能受溶解的接触面的破裂和不规则溶解的影响,而不是代表均匀润湿的晶界特性,事后SEM观察表明,接触面内部粗糙。总之,我们的数据支持以下观点:在石英的压力固溶过程中,晶界扩散迅速,界面过程(溶解和沉淀)比扩散更可能是限速的。

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