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Uncooled MWIR and LWIR photodetectors in Poland

机译:波兰的非制冷MWIR和LWIR光电探测器

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The history, status, and recent progress in the middle and long wavelength Hg_(1-x)Cd_zTe infrared detectors operating at near room temperatures are reviewed. Thermal generation of charge carriers in narrow gap semiconductor is a major limitation or sensitivity. Cooling is a straightforward way to suppress thermal generation of charge carriers and reduce related noise. However, at the same time, cooling requirements make infrared systems bulky, heavy, and inconvenient in use. A number of concepts to improve performance of photodetectors operating at near room temperatures have been proposed and implemented. Recent considerations of the fundamental detector mechanisms suggest that near perfect detection can be achieved without the need for cryogenic cooling. This paper, to a large degree, is based on the research, development, and commercialization of uncooled HgCdTe detectors in Poland. The devices have been based on 3D-variable band gap and doping level structures that integrate optical, detection and electric functions in a monolithic chip. The device architecture is optimized for the best compromise between requirements of high quantum efficiency, efficient and fast collection of photogenerated charge carriers, minimized thermal generation, reduced parasitic impedances, wide linear range, wide acceptance angles and other device features. Recent refinements in the devices design and technology have lead to sensitivities close to the background radiation noise limit, extension of useful spectral range to > 16 pm wavelength and picosecond range response times. The devices have found numerous applications in various optoelectronic systems. Among them there are fast scan FTIR spectrometers developed under MEMFIS project.
机译:回顾了在室温附近工作的中长波长Hg_(1-x)Cd_zTe红外探测器的历史,状态和最新进展。窄间隙半导体中电荷载流子的发热是主要限制或敏感性。冷却是抑制电荷载流子发热并减少相关噪声的直接方法。但是,同时,冷却要求使红外系统体积大,笨重且使用不便。已经提出并实现了许多改善在室温附近工作的光电探测器性能的概念。对基本检测器机制的最新考虑表明,无需进行低温冷却即可实现近乎完美的检测。本文在很大程度上基于波兰未冷却HgCdTe探测器的研究,开发和商业化。该器件基于3D可变带隙和掺杂级结构,这些结构在单片芯片中集成了光学,检测和电功能。器件结构经过了优化,可以在高量子效率,高效快速收集光生电荷载流子,最小化热产生,降低的寄生阻抗,宽线性范围,宽接收角和其他器件特性之间达成最佳折衷。器件设计和技术的最新改进导致灵敏度接近于背景辐射噪声极限,将有用的光谱范围扩展到大于16 pm的波长,以及皮秒范围的响应时间。器件已在各种光电系统中得到了广泛的应用。其中有MEMFIS项目开发的快速扫描FTIR光谱仪。

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