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INVESTIGATION ON THE MICROCRACKING OF CERAMIC MATERIALS USING THE ACOUSTIC EMISSION METHOD

机译:声发射法研究陶瓷材料的微裂纹

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This paper presents the results of investigations on the microcracking of composite ceramic materials, such as electrical engineering porcelain and silicon nitride ceramics, using the acoustic emission technique. The analytical expression describing the kinetics ofmicrocrack accumulation is refined. The influence of the loading rate on the strength characteristics of ceramics and the special features of acoustic emission during their cracking are studied. The dependence of the total acoustic emission count on the stressed surface area of specimens is found. The notion of the microcracking modulus of ceramic composite materials is introduced and its mismatching with the Weibull modulus in strength tests of ceramics is shown.
机译:本文介绍了利用声发射技术对复合陶瓷材料(如电气工程瓷和氮化硅陶瓷)的微裂纹进行研究的结果。细化了描述微裂纹累积动力学的解析表达式。研究了加载速率对陶瓷强度特性的影响以及陶瓷开裂时的声发射特征。发现总声发射计数与样品受应力表面积的相关性。介绍了陶瓷复合材料微裂纹模量的概念,并显示了其在陶瓷强度测试中与威布尔模量的不匹配。

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