Influence of cooling hole geometry and material conductivity on the thermal response of cooled silicon nitride plate

摘要

To complement the effectiveness of ceramic materials and their applicability for turbine engine applications, a parametric study using finite element method is carried out. This study tackles thorough analyses of a thermal harrier coated plate specimen with cooling holes made out of Silicon Nitride (Si{sub}3N{sub}4) where its thermal conductivity is varied in an attempt to minimize the thermal stresses and to optimize an ultimate state of stress. The thermal stress profile was generated for circular and square cooling channels. Lower stresses for a higher magnitude of thermal conductivity are reported. Contour plots for the stresses and the temperature are presented and discussed.