Advancement in microstructure and mechanical properties of lanthanum-doped tin-silver-copper lead free solders by optimizing the lanthanum doping concentration

摘要

Purpose - The purpose of this paper is to analyze the effect of lanthanum (La) doping on the microstructure and mechanical properties of tin-silver-copper (SAC) alloys and to find out an optimum La doping concentration upon which the best set of the desirable properties can be possible. SAC tertiary Pb-free solders are thought to be the best substitutes for Pb-based solders but have limitations due to their coarse microstructure.