...
首页> 外文期刊>Soldering & Surface Mount Technology >Dissolution rates of iron plating on soldering iron tips in molten lead-free solders
【24h】

Dissolution rates of iron plating on soldering iron tips in molten lead-free solders

机译:熔融无铅焊料中烙铁头上的镀铁溶解速率

获取原文
获取原文并翻译 | 示例
   

获取外文期刊封面封底 >>

       

摘要

The dissolution rates of iron and alloyed steels in molten lead-free solders were investigated in order to clarify the effect of erosion of iron plating on soldering iron tips. The dissolution rates of iron-based alloys in lead-free solders were found to be about three times greater than in conventional Sn-Pb eutectics, indicating that the iron plating of a soldering iron tip is subjected to heavier damage when used with lead-free rather than eutectic Sn-Pb. Several steel alloys showed dissolution rates similar to that of pure iron, suggesting that compositional changes in the iron plating may have little influence on the erosion depth. Decreases in the reaction temperature and time, and a small addition of iron into the solder was found to be effective in suppressing both dissolution of iron wire and erosion of iron plating.
机译:研究了铁和合金钢在熔融无铅焊料中的溶解速率,以阐明铁镀层腐蚀对烙铁头的影响。发现铁基合金在无铅焊料中的溶解速率大约是常规Sn-Pb共晶材料的三倍,这表明与无铅焊料一起使用时,烙铁头的铁镀层遭受更重的破坏而不是共晶的Sn-Pb。几种钢合金的溶解速率与纯铁相似,表明铁镀层中的成分变化对腐蚀深度的影响很小。反应温度和时间降低,并且发现在焊料中少量添加铁可有效地抑制铁丝的溶解和铁镀层的侵蚀。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号