首页> 外文期刊>Solar Energy Materials and Solar Cells: An International Journal Devoted to Photovoltaic, Photothermal, and Photochemical Solar Energy Conversion >Fabrication of antireflective layers on silicon using metal-assisted chemical etching with in situ deposition of silver nanoparticle catalysts
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Fabrication of antireflective layers on silicon using metal-assisted chemical etching with in situ deposition of silver nanoparticle catalysts

机译:使用金属辅助化学刻蚀和原位沉积银纳米颗粒催化剂在硅上制备抗反射层

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Ag particle-assisted chemical etching of silicon wafers in HF/H _2O _2 is of interest for its potential to produce antireflective layers for solar cells. In this work, Ag films containing both nanoscale (d<100 nm) and microscale (d<1 μm) particles were deposited through the silver-mirror reaction on planar p-Si(111), planar p-Si(100) and p-Si(100) pre-etched in KOH/isopropanol to produce pyramidal textures. Subsequently, these wafers were subjected to metal-assisted chemical etching (MacEtch) in 1:1:1 (v:v:v) HF(49%):H _2O _2(30%):EtOH solutions, to produce porous silicon (PSi) containing both micro- and nanoscale roughness features. The resulting surfaces exhibit morphologies that evolve with processing conditions, especially the absence/presence of pyramidal textures and the time the structure is subjected to MacEtch. Under optimal conditions excellent anti-reflection behavior is observed with surface reflectivities being reduced below 10% for either p-Si(100) or p-Si(111) surfaces. For p-Si(100) better results (R~5%) were obtained for 30 min KOH/isopropanol pre-etch than for either no pre-etch or longer (60 min) pre-etch. The influence of the reductant on Ag particle deposition on p-Si(111) was studied, and MacEtch catalyzed by Ag produced from acetaldehyde reductant produced surfaces with lower reflectivities than those with glucose reductant.
机译:在HF / H _2O _2中用Ag颗粒辅助化学蚀刻硅片的潜力在于它有可能产生用于太阳能电池的抗反射层。在这项工作中,通过银镜反应在平面p-Si(111),平面p-Si(100)和p上沉积了同时包含纳米级(d <100 nm)和微米级(d <1μm)颗粒的Ag膜。 -Si(100)在KOH /异丙醇中预蚀刻以产生金字塔形纹理。随后,这些晶片在HF(49%):H _2O _2(30%):EtOH溶液中以1:1:1(v:v:v)进行金属辅助化学蚀刻(MacEtch),以生产多孔硅( PSi)包含微米级和纳米级粗糙度特征。所得表面显示出随加工条件而变化的形貌,尤其是不存在/存在棱锥纹理以及结构经受MacEtch的时间。在最佳条件下,对于p-Si(100)或p-Si(111)表面,观察到优异的抗反射性能,且表面反射率降低到10%以下。对于p-Si(100),KOH /异丙醇30分钟的预蚀刻比没有预蚀刻或更长(60分钟)的预蚀刻获得更好的结果(R〜5%)。研究了还原剂对p-Si(111)上Ag颗粒沉积的影响,乙醛还原剂产生的Ag催化的MacEtch产生的反射率比葡萄糖还原剂的反射率低。

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