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Effects of silicon addition on thermoelectric properties of bulk Zn_4Sb_3 at low-temperatures

机译:低温下硅添加对块状Zn_4Sb_3热电性能的影响

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摘要

The thermoelectric properties of Si-doped compounds (Zn_(1-x)Si_x)_4Sb_3 (x= 0, 0.0025, 0.005, 0.01) have been studied. The results indicate that low-temperature (T < 300 K) thermal conductivity of moderately doped (Zn_(0.9975)Si_(0.0025))_4Sb_3 reduces remarkably as compared with that of Zn_4Sb_3 due to enhanced impurity (dopant) scattering of phonons. Electrical resistivity and Seebeck coefficient are found to increase and then decrease moderately with the increase in the Si content. In addition, first-principles calculations are performed on the occupation options of Si atoms in disordered β-Zn_4Sb_3. The results indicate that Si atoms occupy preferentially the Zn vacancies in normal sites. Subsequently, Si atoms will substitute for interstitial Zn atoms. The lightly doped compound (Zn_(0.9975)Si_(0.0025))_4Sb_3 exhibits the best thermoelectric performance due to the improvement in both its thermal conductivity and Seebeck coefficient. Its figure of merit, ZT, is about 1.3 times larger than that of pure Zn_4Sb_3 at 300 K.
机译:研究了掺硅化合物(Zn_(1-x)Si_x)_4Sb_3(x = 0,0.0025,0.005,0.01)的热电性能。结果表明,由于声子的杂质(掺杂剂)散射增强,中等掺杂的(Zn_(0.9975)Si_(0.0025))_ 4Sb_3的低温(T <300 K)导热系数比Zn_4Sb_3显着降低。发现随着Si含量的增加,电阻率和塞贝克系数增加,然后适度降低。此外,对无序β-Zn_4Sb_3中的Si原子的占据选项进行了第一性原理计算。结果表明,硅原子优先占据正常位点的锌空位。随后,Si原子将取代间隙Zn原子。轻掺杂化合物(Zn_(0.9975)Si_(0.0025))_ 4Sb_3由于其导热系数和塞贝克系数的提高而表现出最佳的热电性能。在300 K时,它的品质因数ZT约为纯Zn_4Sb_3的1.3倍。

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