Optical Bonding: Critical Technical Challenges for Performance, Manufacturing, and Supply Chain

摘要

Optical Bonding for cover lens protecting MFT sensors has become a key element for smart phones and tablet pc's and in other larger format applications. This paper will review the technical, performance and financial challenges that are being confronted by industry as well as the implementation strategies of various options. Since 2007, Optical Bonding has become a critical aspect of the performance and supply chain implantation of PCAP; the financial impact in 2007 has grown from < $500M to $3 to 4B USD annually.