首页> 外文期刊>Scripta materialia >Thermoelectric properties of Cu-doped p-type pseudo-binary Cu_xBi_(0.5)Sb_(1.5-x)Te_3 (x = 0.05-0.4) alloys prepared by spark plasma sintering
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Thermoelectric properties of Cu-doped p-type pseudo-binary Cu_xBi_(0.5)Sb_(1.5-x)Te_3 (x = 0.05-0.4) alloys prepared by spark plasma sintering

机译:火花等离子体烧结制备的Cu掺杂p型拟二元Cu_xBi_(0.5)Sb_(1.5-x)Te_3(x = 0.05-0.4)合金的热电性能

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摘要

Measurements conducted on the Cu-doped Cu_xBi_(0.5)Sb_(1.5-x)Te_3 (x = 0.05-0.4) alloys show that their electrical conductivities are approximately 8.6 and 2.3 times those of the ternary Bi_(0.5)Sb_(1.5)Te_3 alloy at room temperature and 558 K, respectively, and reveal a drastic reduction of lattice thermal conductivities after Cu doping. The highest dimensionless figure of merit ZT of 1.2 is achieved for the materials with x = 0.05 at 442 K, being approximately 2.1 times that of typical ternary Bi_(0.5)Sb_(1.5)Te_3 alloy at room temperature.
机译:在掺杂Cu的Cu_xBi_(0.5)Sb_(1.5-x)Te_3(x = 0.05-0.4)合金上进行的测量表明,它们的电导率分别是三元Bi_(0.5)Sb_(1.5)Te_3的电导率的8.6和2.3倍合金分别在室温和558 K下显示,并且在掺杂Cu后显着降低了晶格热导率。对于x = 0.05在442 K下获得的材料,最高无因次品质因数ZT为1.2,约为室温下典型三元Bi_(0.5)Sb_(1.5)Te_3合金的2.1倍。

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