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Scanning electron microscopy examination of telecommunication single mode fiber splices

机译:电信单模光纤接头的扫描电子显微镜检查

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Longitudinal sections of fused splices of different telecommunication single mode fibers were prepared and examined by scanning electron microscopy (SEM). Splices were examined for diffusion of dopant elements and for the presence of an intermediate zone. Observations in the material contrast mode obtained with backscattered electrons and X-ray microanalysis with the use of an energy dispersive spectrometer were made. Material contrast provides much better imaging of fiber cores than X-ray microanalysis and it was chosen for further studies. SEM micrographs show low amount of diffusion and good coupling of cores in splices under examination. No visible intermediate zone has been found in splices of the same fibers or fibers with similar cores. In splices of fibers with different core diameters and/or different dopant distribution the transition between cores is smooth with no visible widening of cores.
机译:制备了不同电信单模光纤熔接的纵向截面,并通过扫描电子显微镜(SEM)进行了检查。检查接头中掺杂元素的扩散和中间区的存在。使用能量散射光谱仪,通过背散射电子和X射线显微分析,以材料对比模式进行了观察。物质对比提供比X射线微分析更好的纤维芯成像,因此它被选择用于进一步研究。 SEM显微照片显示,在检查中的接头中扩散量低且纤芯耦合良好。在相同纤维或具有相似芯的纤维的接头中未发现可见的中间区域。在具有不同纤芯直径和/或不同掺杂剂分布的光纤接头中,纤芯之间的过渡是平滑的,纤芯没有可见的变宽。

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