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首页> 外文期刊>CERAMICS INTERNATIONAL >Processing of diamond particle reinforced silicon(Ti) matrix composites by in-situ reactive sintering and their thermal properties
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Processing of diamond particle reinforced silicon(Ti) matrix composites by in-situ reactive sintering and their thermal properties

机译:原位反应烧结处理金刚石颗粒增强硅(Ti)基复合材料及其热性能

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摘要

An innovative method of in-situ reactive preparation of diamond/silicon(Ti) matrix composites by spark plasma sintering (SPS) process was applied to produce specimens and the effect of Ti-addition to Si matrix was demonstrated. The relative density of diamond/Si(Ti) matrix composite was > 98.1% in a volume fraction of diamond ranging from 40% to 60%. Actually, Si(Ti)/diamond composites containing 60% in volume diamond particles yielded a thermal conductivity (TC) of 525 Wm~(-1)K~(-1) at room temperature along with a thermal expansion coefficient (TEC) of 1.643 × 10 K~(-1) at 573 K. TC and TEC of the experimental data were compared with the predictions from several theoretical models. Microstructures of these materials were studied by field emission scanning electron microscopy (FE-SEM) and X-ray diffraction (XRD). Ti addition lowered the melting point and resulted in the formation of TiSi_2 phase in Si matrix. The results show that Ti addition is an effective approach for promoting the relative packing density and improving thermal conductivity of sintered samples.
机译:采用新颖的火花等离子体烧结(SPS)原位反应制备金刚石/硅(Ti)基复合材料的方法,制备了试样,并证明了将Ti添加到Si基体中的作用。金刚石/ Si(Ti)基复合材料的相对密度在金刚石的体积分数为40%至60%的范围内> 98.1%。实际上,包含60%体积金刚石颗粒的Si(Ti)/金刚石复合材料在室温下的热导率(TC)为525 Wm〜(-1)K〜(-1),而热膨胀系数(TEC)为在573 K时1.643×10 K〜(-1)。将实验数据的TC和TEC与几种理论模型的预测值进行了比较。通过场发射扫描电子显微镜(FE-SEM)和X射线衍射(XRD)研究了这些材料的微观结构。钛的添加降低了熔点并导致在Si基体中形成TiSi_2相。结果表明,添加Ti是提高烧结样品的相对堆积密度和提高导热率的有效方法。

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